Test and enable circuitry connected between embedded die circuits

ABSTRACT

Timely testing of die on wafer reduces the cost to manufacture ICs. This disclosure describes a die test structure and process to reduce test time by adding test pads on the top surface of the die. The added test pads allow a tester to probe and test more circuits within the die simultaneously. Also, the added test pads contribute to a reduction in the amount of test wiring overhead traditionally required to access and test circuits within a die, thus reducing die size.

This application is a divisional of application Ser. No. 13/097,352,filed Apr. 29, 2011, now U.S. Pat. No. 8,168,970, issued May 1, 2012;which was a divisional of application Ser. No. 12/495,060, filed Jun.30, 2009, now U.S. Pat. No. 7,956,357, issued Jun. 7, 2011; Which was adivisional of application Ser. No. 12/047,907, filed Mar. 13, 2008, nowU.S. Pat. No. 7,569,853, issued Aug. 4, 2009; Which was a divisional ofapplication Ser. No. 11/279,509, filed Apr. 12, 2006, now U.S. Pat. No.7,368,304, issued May 6, 2008; Which was a divisional of applicationSer. No. 10/610,437, filed Jun. 30, 2003, now U.S. Pat. No. 7,056,752,issued Jun. 6, 2006; which was a divisional of application Ser. No.10/051,536, filed Jan. 18, 2002, now U.S. Pat. No. 6,590,225, issuedJul. 8, 2003; which claims priority from provisional application60/263,134, filed Jan. 19, 2001.

PRIOR ART DESCRIPTION

FIG. 1 illustrates a semiconductor wafer 101 comprising multiple die102. After the wafer 101 is manufactured all die 102 on the wafer mustbe tested to identify good die from bad die. The testing of all die onwafer can be a time consuming process, especially when the die containmultiple complex digital and/or analog circuits, which is the currenttrend in the semiconductor industry.

FIG. 2 illustrates a more detail example of one of the die 102. As seenin FIG. 2, the die 102 contains multiple embedded circuits A-I. Thecircuits A-I could be any type of circuits such as digital signalprocessor cores, microprocessor cores, mixed signal circuits such ADCsand DACs, peripherals, or memories. Each circuit A-I has input 201 andoutput 202 terminals. The die has input 203 and output 204 pads forconnecting to external circuitry. Internally, the circuits A-I areconnected together at their input 201 and output 202 terminals viaconnections 206, allowing them to function together. Certain of thecircuits A-I are connected to the die input 203 and output 204 pads viaconnections 205 and 207 to allow external communication. Typically,during the test of the die 102, each circuit A-I is individually tested.The following examples in FIGS. 3 and 4 describe how a conventional testapproach can be used for selecting and testing the circuits A-I of die102.

FIG. 3 illustrates a prior art test approach whereby the die isconfigured to connect the input 201 and output 202 terminals of circuitE to the die input 203 and output 204 pads via test bussing paths301-304. A similar test approach where inputs and outputs of embeddedcircuits are bussed to die pads for testing, as shown in FIG. 3, isdescribed in TI patent U.S. Pat. No. 5,005,173.

FIG. 4 illustrates an example test arrangement 400 consisting of die 102to be tested, tester 401 to supply test patterns, and probe mechanism402 for making connections between tester 401 and pads of die 102. It isassumed that Die 102 is configured for testing circuit E as described inregard to FIG. 3. During test, the tester 401 outputs test stimuluspatterns to the input terminals 201 of circuit D via input pads 203 andtest bussing paths 301 and 302, and inputs test response patterns fromoutput terminals 202 of circuit E via test bussing paths 303 and 304. Inthis example, it is assumed that circuit E does not contain design fortest features, such as scan design, so functional testing must beperformed on circuit E by manipulation of all, or at least a significantnumber of, the circuit E input and output terminals.

When testing of circuit E is complete, another circuit, such as D may beselected and connected to the input 203 and output 204 pads, viaadditional test bussing paths, like 301-304, and tested like circuit Ewas described being tested. During the testing of die 102, all circuitsA-I will eventually be selected and tested in the manner describedabove. Since some of the circuits A-I are directly connected on at leastsome of their input 201 and output 202 terminals to input 203 and output204 pads, fewer additional test bussing paths may be required for theirtesting. However, all circuits A-I that have input 201 and output 202terminals that are not functionally connected to input 203 and output204 pads will require a test bussing path to be configured during test.

While the test approach of using configurable test bussing paths toselect and test embedded circuits, as described above, is a simpleprocess, it introduces two key problems. The first problem is that theadditional test bussing paths required for selecting and testing thecircuits adds circuitry and wiring overhead to the die, thus increasingdie size and potentially increasing the amount of noise and crosstalkproduced during functional operation of the die. The second problem isthat when some of the input 203 and output 204 pads are being used totest one of the circuits A-I, they cannot necessarily also be used totest another of the circuits A-I. For example, since some of the input201 terminals of circuits D and E are connected during test to a commonset of input 203 pads, via test bus 301, it is not possible to testcircuits D and E simultaneously. Thus, testing of the circuits A-I ofdie 102 may need to occur in a one-at-a-time fashion, which leads tolonger die test times. The present invention, as described in detailbelow, provides solutions for these two problems.

BRIEF DESCRIPTION OF THE VIEWS OF THE DRAWINGS

FIG. 1 illustrates a conventional semiconductor wafer.

FIG. 2 illustrates a conventional die on the wafer of FIG. 1.

FIG. 3 illustrates a conventional test approach for testing circuit inthe die of FIG. 2.

FIG. 4 illustrates a conventional die test arrangement.

FIG. 5 illustrates a die with top surface test pads according to theinvention.

FIG. 6 illustrates a first view of test pads and circuitry of theinvention.

FIG. 7 illustrates a second view of test pads and circuitry of theinvention.

FIG. 8 illustrates a third view of test pads and circuitry of theinvention.

FIG. 9 illustrates a first die test arrangement according to theinvention.

FIG. 10 illustrates a simplified view of test pads and circuitry of theinvention.

FIG. 11 illustrates a second die test arrangement according to theinvention.

FIG. 12 illustrates a die with top surface test pads according to theinvention.

FIG. 13 illustrates a third die test arrangement according to theinvention.

FIG. 14 illustrates a circuit in a die equipped with dedicated inputterminals for connecting to top surface test pads according to theinvention.

FIG. 15 illustrates in more detail the circuit of FIG. 14 with topsurface test pad input terminals.

FIG. 16 illustrates conventional power and ground die pad probing.

FIG. 17 illustrates power and ground test pad probing according to theinvention.

DETAILED DESCRIPTION OF THE DISCLOSURE

FIG. 5 illustrates a die 501 according to the present invention. Die 501is the same as die 201 with the exception that top surface test pads 502have been processed onto the die and connected to associated ones of theinput 201 and output 202 terminals of circuits A-I. Test pads 502 differfrom the die input 203 and output 204 pads in that they are used toprovide test access to the circuits A-I and not for functionalcommunication to circuits external to die 501. As seen in FIG. 5, thetest pads 502 are preferably located in close proximity to an associatedinput 201 terminal or output 202 terminal of circuits A-I. Also as seen,a circuit A-I need not necessarily have a test pad associated with aninput 201 or output 202 terminal if test access is already provided byan input 203 or output 204 die pad. For example, circuit D does not needtest pads 502 on its input 201 terminals that are functionally connectedto input 203 die pads. Similarly, circuit F does not necessarily needtest pads 502 on its output 202 terminals that are functionallyconnected to output 204 die pads. However, test pads 502 may be locatedon these input 201 and output 202 terminals, as indicated by dotted linetest pads 502, if it is desired not to probe the die input 203 andoutput 204 die pads. A reason for not probing the input 203 and output204 die pads would be to avoid marring the die pads, which could lead tocontinuity problems when die is either mounted onto a substrate orassembled into a package. For example, the solder connections betweendie pads and a substrate footprint may be improved if the die pads 203,204 are not scarred during probe testing. Further, bonding of the diepads 203, 204 to a lead frame may be improved if the die pads are notscarred during die probe testing.

FIG. 6 illustrates a horizontal cross-sectional schematic view 600 ofdie 501 as an aid in revealing the test circuitry and wiring associatedwith the test pads 502 according to the invention. To simplify thefollowing description, only horizontally positioned circuits D, E, and Fof die 501 are shown. Also, test pads 502 of FIG. 5 have been relabeledas test pads 601-607 in FIG. 6. As seen in FIG. 6, conventional input203 and output 204 pads have been processed at the perimeter of the dieto provide said external input and output communication. During testthese input 203 and output 204 pads are additionally used to providetest inputs to circuit D and test outputs from circuit F. As seen inFIG. 6, the test pads 601-607 have been processed on the top surface ofthe die to provide test input and output access to circuits D-F.

Input pads 203 are connected to inputs of functionally required inputbuffers 608 which drive the input terminals 201 of circuit D. Outputpads 204 are connected to the outputs of functionally required outputbuffers 616 which are driven by output terminals 202 of circuit F.

Test pad 601 is provided as a test enable input for circuit D. Test pad601 is connected to the input of a test buffer 609. The output of testbuffer 609 is connected to the enable input of test buffers 610 and to afirst input of OR gate 619. The output of test buffer 609 also driveslead 624 which will be described later in regard to FIG. 7. The outputof gate 619 is connected to the enable input of test isolation buffers617. The output of test buffer 609 may also be connected 626 as an inputto circuit D, via an input terminal 201, to enable circuit D fortesting. For example, circuit D may have one or more test modes whichcan be invoked by input on test pad 601 to simplify its testing. Theremay be a plurality of test pads 601 and test buffers 609 if circuit Drequires plural inputs to invoke its test modes. However, at least oneof the test pads 601 and test buffers 609 needs to be used for enablingand disabling test buffers 610 and isolation buffers 617. Test pads 602are provided as test outputs for circuit D. Test pads 602 are connectedto the outputs of a test buffers 610. The inputs of test buffers 610 areconnected to the output terminals 202 of circuit D.

Test pads 603 are provided as a test inputs for circuit E. Test pads 603are connected to the inputs of test buffers 611. The outputs of testbuffers 611 are connected to the input terminals 201 of circuit E. Testpad 604 is provided as a test enable input for circuit E. Test pad 604is connected to the input of a test buffer 612. The output of testbuffer 612 is connected to the enable inputs of test buffers 611 and613, to a second input of OR gate 619, and to a first input of OR gate620. The output of gate 620 is connected to the enable input of testisolation buffers 618. As mentioned in regard to test pad 601 and testbuffer 609, one or more test pads 604 and test buffers 612 may provideinput 627 to circuit E to enable its testing. Test pads 605 are providedas test outputs for circuit E. Test pads 605 are connected to theoutputs of a test buffers 613. The inputs of test buffers 613 areconnected to the output terminals 202 of circuit E.

Test pads 606 are provided as a test inputs for circuit F. Test pads 606are connected to the inputs of test buffers 614. The outputs of testbuffers 614 are connected to the input terminals 201 of circuit F. Testpad 607 is provided as a test enable input for circuit F. Test pad 607is connected to the input of a test buffer 615. The output of testbuffer 615 is connected to the enable inputs of test buffers 614, and toa second input of OR gate 620. The output of test buffer 615 also driveslead 625 which will be described later in regard to FIG. 8. Again, oneor more test pads 607 and test buffers 615 may be connected as input 628to circuit F to enable its testing.

Pull up circuits 621-623 are located on the inputs of test buffers 609,612, and 615. The purpose of the pull up circuits is to force the testcircuitry into a state that will not interfere with the functionaloperation of the circuits A-I when the die is not being tested. Forexample, if test pads 601, 604, and 607 are not being driven by anexternal circuit/tester, the pull up circuits will force the inputs oftest buffers 609, 612, and 615 high. Since test buffers 609, 612, and615 are inverting types, their outputs will be set low while theirinputs are high. In this example, a low on the outputs of test buffers609, 612, and 615 will disable the outputs of test buffers 610, 611,613, and 614, and enable the outputs of test isolation buffers 617 and618. Thus circuits D, E, and F of FIG. 6 may functionally communicatevia the test isolation buffers 617 and 618 while test pads 601, 604, and607 are not being driven low by an external circuit/tester.

FIG. 7 illustrates a vertical cross-sectional schematic view 700 ofcircuits A, D and G of die 501. The purpose of FIG. 7 is show how lead624 of FIG. 6 is used to control further test input to circuit D fromadditional test pads 703 and to control further test output from circuitD from additional test pads 705. When test pad 601 is driven low, lead624 goes high. In response to lead 624 being high, the outputs of testisolation buffers 717 and 718 are disabled, via OR gates 719 and 720,and the outputs of test buffers 711 and 713 are enabled. In thiscondition, circuit D can receive test input from test pads 703 andtransmit test output from test pads 705. Thus when FIGS. 6 and 7 areviewed together, it can be seen that complete test input and outputaccess is provided to circuit D using a combination of test pads 603,605, 703, and 705 and die pads 203 and 204. The die pads 203, test pads701-702, buffers 708-710, pull up 721, and lead 724 elements associatedwith circuit A of FIG. 7 relate to the die pads 203, test pads 601-602,buffers 608-610, pull up 621, and lead 624 elements previously describedin regard to circuit D of FIG. 6. Further, the die pads 204, test pads706-707, buffers 714-716, pull up 723, and lead 725 elements associatedwith circuit G of FIG. 7 relate to the die pads 204, test pads 606-607,buffers 614-616, pull up 623, and lead 625 elements previously describedin regard to circuit F of FIG. 6.

FIG. 8 illustrates a vertical cross-sectional schematic view 800 ofcircuits C, F and I of die 501. The purpose of FIG. 8, as with FIG. 7,is show how lead 625 of FIG. 6 is used to control further test input tocircuit F from additional test pads 803 and to control further testoutput from circuit F from additional test pads 805. When test pad 607is driven low, lead 625 goes high. In response to lead 625 being high,the outputs of test isolation buffers 817 and 818 are disabled, via ORgates 819 and 820, and the outputs of test buffers 811 and 813 areenabled. In this condition, circuit F can receive test input from testpads 803 and transmit test output from test pads 805. Thus when FIGS. 6and 8 are viewed together, it can be seen that complete test input andoutput access is provided to circuit F using a combination of test pads603, 605, 803, and 805 and die pads 203 and 204. The die pads 203, testpads 801-802, buffers 808-810, pull up 821, and lead 824 elementsassociated with circuit C of FIG. 8 relate to the die pads 203, testpads 601-602, buffers 608-610, pull up 621, and lead 624 elementspreviously described in regard to circuit D of FIG. 6. Further, the diepads 204, test pads 806-807, buffers 814-816, pull up 823, and lead 825elements associated with circuit I of FIG. 8 relate to the die pads 204,test pads 606-607, buffers 614-616, pull up 623, and lead 625 elementspreviously described in regard to circuit F of FIG. 6. From the abovedescription of FIGS. 6-8 and in reference to the die circuit example ofFIG. 5, it is clear that only circuit A receives test input exclusivelyfrom die pads 203 and only circuit I transmits test output exclusivelyfrom die pads 204. Thus circuit A test buffer 709 of FIG. 7 need onlycontrol (i.e. enable/disable) the outputs of test buffers and testisolation buffers associated with the output terminals 202 of circuit A,and circuit I test buffer 815 of FIG. 8 need only control the outputs oftest buffers and test isolation buffers associated with the inputterminals 201 of circuit I. The test enable buffers of circuitsB,C,D,F,G, and H of die 501 will need to control the outputs of all testbuffers and test isolation buffers that are associated with eachcircuit's input 201 and output 202 terminals. Circuit E of die 501 isthe only circuit that receives test input and transmits test outputexclusively using test pads 502. All other circuits in die 501 receivetest input and transmit test output using a combination of die pads 203and 204 and test pads 502.

FIG. 9 illustrates a test arrangement 900 consisting of a tester 901,probe mechanism 902 and die 501 to be tested. Circuit blocks 930-932 ofFIG. 9 represent all the vertical and horizontal schematic views ofcircuits A-I in die 501, i.e. circuits 930-932 represent horizontalviews of circuits ABC, DEF, GHI, and circuits 930-932 represent verticalviews of circuits ADG, BEH, and CFI. During testing of circuits 930-932,tester 901 sets test pads 901, 904, 907 low and inputs and output testpatterns to circuits 930-932 as previously described using a combinationof die pads 203, 204 and test pads 902, 903, 905, 907. During test, theoutputs of test isolation buffers 917 and 918 are disabled to isolatethe circuits 930-932 from one another so that each circuit may receivedtest input from and transmit test output to tester 901 via test buffers910, 911, 913, and 914. As can be seen from FIG. 9, all the circuits930-932 can be tested individually, in selected groups, or all at oncesince all the circuit's input 201 and output 202 terminals are availableto the tester 901. Being able to test all circuits 930-932 at the sametime reduces the die 501 test time and therefore the wafer 101 testtime, which reduces manufacturing cost.

FIG. 10 illustrates a simplification of the die 501 test circuitry 1000described in regard to FIGS. 6-9. The simplification is based on the useof a single test enable pad 1001 as the enable/disable control input toall test buffers and test isolation buffers. This simpler testarchitecture can be used whenever it is determined that all circuits A-Iwill always be accessed for testing at the same time, as opposed to theselective test access provided by the test architectures of FIG. 6-9. Asseen in FIG. 10, the OR gates 919-920 have been deleted and a directconnection is made between the output of the test buffer 912 and controlinputs of test isolation buffers 917 and 918. Also, only a single pullup circuit 922 is required to maintain a high state at the input of testbuffer 912 when it is not externally driven. As previously described,each circuit 930-932 may receive an input from the single test enablepad 1001 via connection 1027 to place them in a test mode. FIG. 11illustrates a test arrangement 1100 whereby a tester 1101 makes contactto the die 501 of FIG. 10, via probe mechanism 1102, and uses the singletest pad 1001 to access all input 201 and output 202 terminals ofcircuits 930-932 for testing.

FIG. 12 illustrates a die 1201 that includes a circuit A and circuit Dthat have input terminals connected to common die input pads 1202. Also,die 1201 includes a circuit C and circuit F that have output terminalsconnected to common die output pads 1205. To allow simultaneous testingof circuits A and D, test pads 1203 and 1204 are provided at the testinput terminals of circuits A and D and test pads 1206 and 1207 areprovided at the test output terminals of circuits C and F. As opposed tothe optional use of the dotted line test pads 502 of FIG. 5 to preventmarring of the die pads 203 and 204, these test pads(1203,1204,1206,1207) are required if circuits A and D, and circuits Cand F are to be tested simultaneously.

FIG. 13 illustrates a test arrangement consisting of a tester 1301,probe mechanism 1302, and a horizontal cross sectional schematic view ofdie 1201. Circuits 1330-1332 represent circuits ABC and DEF of FIG. 12.In FIG. 13, test pads 1203 and 1204 are connected to the inputs of testbuffers 1211. The outputs of test buffers 1211 are connected to theshared input terminals 201 of circuits A and D. Also, test isolationbuffers 1208 are inserted between the output of shared input buffers1214 driven by die pads 1202 and input terminals 201 of circuits A andD. Test pads 1206 and 1207 are connected to the outputs of test buffers1212. The inputs of test buffers 1212 are connected to the shared outputterminals 202 of circuits C and F. Also, test isolation buffers 1209 areinserted between the output terminals of circuits C and F and the inputof the shared output buffers 1215, which drives die pads 1205.

As can be seen from FIG. 13, when the die is placed in test mode by alow on test pad 1210, the outputs of test isolation buffers 1208 and1209 are disabled and the outputs of test buffers 1211 and 1212 areenabled. In this mode the tester can simultaneously input different testdata to circuits A and D via test pads 1203 and 1204 respectively, andoutput different test data from circuits C and F via test pads 1206 and1207 respectively. Thus circuits A and D, and circuits C and F can besimultaneously tested by the application of test pads and associatedtest and isolation buffers at their shared input and output terminals.

FIG. 14 illustrates a die 1401 that includes a circuit E that has beendesigned to include test input terminals 1405 for connecting to topsurface test pads 1402, and input terminals 201 for connecting to theoutput terminals 202 of circuits D and B. Circuit E also has an inputterminal 1406 for connecting to a top surface test enable pad 1403. Testpads 1402 and 1403 are similar to test pads 502 of FIG. 5, with theexception that they are connected to input terminals of Circuit E ratherthan to circuits (i.e. test buffers 611, 613 and test isolation buffers617, 618 of FIG. 6) external of Circuit E. Circuit E of FIG. 14 may be ahard (i.e. fixed design) DSP/CPU core circuit that includes test inputpads 1405 to simplify its testing when embedded within a die 1401.

FIG. 15 illustrates a portion of circuit E 1501 of FIG. 14 in moredetail. As seen, the input terminals 201 of circuit E are connected viawires 1512-1514 and 1515-1516 to the output terminals 202 of circuit Dand B respectively. The wire connections 1512-1516 are free of the testisolation buffers 617 shown in FIG. 6, and directly connect the outputterminals 202 of circuits D and B to the input terminals 201 of circuitE. As seen in FIG. 15, each of the top surface test pads 1402 isconnected to one of the test input terminals 1405, and the top surfacetest enable pad 1403 is connected to the test enable input terminal1406. Internal to circuit E 1501, a wire connection exists from the testenable terminal 1406 to the enable inputs of the test buffers 1502,1504, 1506, 1509, and 1511, and to the enable inputs of functionalbuffers 1503, 1505, 1507, 1508, and 1510. The combination of test buffer1502 and functional buffer 1503 form a multiplexer or switch whoseoutput 1517 is input to functional circuitry 1530. Similarly the othertest buffers 1504, 1506, 1509, and functional buffers 1505, 1507, 1508,and 1510 form multiplexers or switches that input to functionalcircuitry 1530 via outputs 1518-1521.

When the test enable pad 1403 is driven high by an externalcircuit/tester, the outputs of the functional buffers 1503, 1505, 1507,1508, and 1510 will be enabled to allow functional signals from circuitsD and B to be input to functional circuitry 1530 of circuit E. When testenable pad 1403 is driven low by an external circuit/tester, the outputsof the test buffers 1502, 1504, 1506, 1509, and 1511 will be enabled toallow test data from an external circuit/test to be input to thefunctional circuitry 1530 via test pads 1402. When test enable pad 1403is not externally driven, a pull up circuit 1522 will force the testenable input terminal 1406 high to force functional operation of circuitE 1501.

In comparing the functional output to input connections between circuitsD and E of FIGS. 5 and 6 to the function output to input connections ofcircuits D and E of FIGS. 14 and 15, it is seen that the functionalityof the test isolation buffers 617 of FIG. 6 is provided by the functioninput buffers 1503, 1505, 1507, 1508, and 1510 of FIG. 15. Thus circuitssuch as E 1501 that include input terminals for test 1405 and functional201 inputs and multiplexing to select either the test or functionalinput to be input to functional circuitry 1530 provide a way toeliminate the need for external test isolation buffers 617 of FIG. 6. Ascan be understood, this improves the signaling time between circuits Dand E since the delay associated with the external test isolationbuffers 617 of FIG. 6 is not present in the signaling paths between Dand E of FIG. 15.

It should be understood that the test enable pad 1403 of FIGS. 14 and 15could also be connected to control the outputs of externally positionedtest buffers and test isolation buffers, as test enable pad 1001 isshown doing in FIG. 10. Also it should be understood that if allcircuits A-I of FIG. 14 used test 1405 and functional 201 inputterminals and internal multiplexing as shown in FIG. 15, no externallypositioned test isolation buffers 917 would be required in any of theoutput to input terminal connections 206 between circuits A-I or in theconnections 205 between input pads 203 and input terminals 201 ofcircuits A, D, G, B, and C.

From the descriptions given in regard to FIGS. 5-15, it is seen that thetwo problems mentioned in regard to FIGS. 3 and 4 have been solved. Thefirst problem, regarding test wiring overhead, is solved since the topsurface test pads 502 only require a small amount of local test wiringat each of the circuits A-I being tested. The second problem, regardingtest time, is solved since the local top surface test pads allowsimultaneous testing of each of the circuits A-I.

During simultaneous testing of multiple circuits A-I in a die, the powerconsumption may increase beyond the normal functional power consumption.The reason for this is that during normal functional operation of a die,only some of the circuits may be operating at any one time. Howeverduring test, a tester may operate all the circuits at the same time inorder to quickly complete the testing of a die.

FIG. 16 illustrates a test arrangement 1600 consisting of a tester 1601,probe mechanism 1602, and a die being tested. The die is assumed to bedie 1201 of FIG. 12, which comprises circuits A-I represented in thecross sectional view of FIG. 16 as circuit blocks 1330-1332. The die1201 has power 1603 and ground 1604 pads for powering up the circuits1330-1332, via internal power rail 1605 and ground rail 1606 bussing.The power 1603 and ground 1604 pads, and rails 1605 and 1606 provideadequate power for the circuits to operate in functional mode. However,when the circuits 1330-1332 are tested simultaneously, they are notprovided with adequate power to operate correctly. Thus during test thecircuits 1330-1332 may fail not due to faults, but rather due toinadequate access to power and ground.

FIG. 17 illustrates a solution, according to the invention, to the abovementioned power and ground problem during simultaneous circuit testing.FIG. 17 is similar to FIG. 16 with the exception that additional testpower 1703-1705 and test ground 1706-1707 pads have been processed onthe top surface of the die 1201. The additional test power 1703-1705pads have been connected, via busses 1708-1710, to the power rail 1605.The additional test ground 1706-1707 pads have been connected, viabusses 1711-1712, to ground rail 1606. During test, the tester 1701 andprobe mechanism 1702 provide power to the normal power 1603 and ground1604 pads and to the addition test power 1703-1705 and ground 1706-1707pads. The additional test power and ground pads provide all theadditional power and ground for the circuits 1330-1332 to besimultaneously tested without encountering the problem mentioned inregard to FIG. 16.

It should be understood that while the voltages of FIGS. 16 and 17 werementioned as being power and ground, the die could be a mixed signaltype requiring additional voltages to operate analog circuitry withinthe die. If other voltage supplies are required, these other voltagescould be supplemented with test pads as described for the power andground supplies of FIG. 17.

It should be understood that while this disclosure has used buffers asthe circuitry for coupling test pads (603, 605) to input and outputterminals (201,202) of circuits A-I, other types of switching circuitrycould be used as well. For example, transmission gates could be used tocouple circuit A-I input and output terminals to test pads.

It should be understood that while this disclosure has used buffers(617, 618) as the circuitry for isolating input and output terminals(201,202) of circuits A-I during test, other types of switchingcircuitry could be used as well. For example, transmission gates couldbe used to isolate the input and output terminals of circuit A-I fromeach other during test.

It should also be understood that the circuits A-I could be digital,analog, or mixed signal circuit types, and said test inputs and/or testoutputs to those circuit types could be in digital (1 and 0) or analog(continuously varying) signaling form.

It should be understood that when a die having test pads (502, 1503,1506) processed on the top surface is prepared for packaging orassembly, an insulating layer may be processed on the top surface of thedie to shield the test pads (power, ground, enable, input, and outputtest pads) from further external contact.

Although the present invention has been described in accordance to theembodiments shown in the figures, one of ordinary skill in the art willrecognize there could be variations to these embodiments and thosevariations should be within the spirit and scope of the presentinvention. Accordingly, modifications may be made by one ordinarilyskilled in the art without departing from the spirit and scope of theappended claims.

What is claimed is:
 1. A die of semiconductor material, comprising: A.die pads arranged at the periphery of the die; B. a first embeddedcircuit having functional inputs and outputs, at least one of thefunctional inputs and outputs being unconnected to a die pad; C. asecond embedded circuit having functional inputs and outputs, at leastone of the functional inputs and outputs being unconnected to a die pad;D. test circuitry coupled between one of the functional outputs of thefirst embedded circuit that is unconnected to a die pad and one of thefunctional inputs of the second embedded circuit that is unconnected toa die pad; and E. test enable circuitry having an input connected to anenable test pad, separate from the die pads, and an output coupled tothe test circuitry.
 2. The die of claim 1 in which the test circuitryincludes a test isolation buffer and the test circuitry includes aseries connection of an input buffer having an input connected to theenable test pad and an OR gate having an output connected to the testisolation buffer.
 3. The die of claim 1 in which the embedded circuit isone of a digital signal processor core, a microprocessor core, mixedsignal circuitry, peripheral circuitry, and memory circuitry.